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Dates: Jan. 16 [Wed] - 18 [Fri] , 2013 Venue: Tokyo Big Sight , Japan Organised by: Reed Exhibitions Japan Ltd.
Toshihiko OkumuraSenior Marketing Manager,Electronic Materials, New Business Development,Asahi Kasei E-materials Corp.
Yoshitaka FukuokaPresident,Worldwide Electronic Integrated Substrate Technology Inc.
Hiroshi IinagaSenior Manager,e Functional Module R&D,Oki Printed Circuits Co., Ltd.
Kiyoshi TomitaGeneral Manager,Business Promotion Div.,Kyocera SLC Technologies Corp.
Koji IkawaDeputy Section Manager, Research Engineer,Market Development Section, Market Development Dept.,Central Region Customers Sales Div.,CMK Corp.
Hirofumi MatsumotoDirector, Chief Development Officer,Product Development Planning Office,Nippon Mektron, Ltd.
Masaaki KatsumataGeneral Manager, Engineering Group,Printed Circuit Board Business Unit,Panasonic Electronic Devices Co., Ltd.
Daizou BabaChief Engineer,Electronic Materials Technology Development Center,Electronic Components and Materials Business Group,Panasonic Corp.
Yoshihiro NakamuraDeputy General Manager,Printed Wiring Board Manager,Printed Wiring Board Materials Business Sector,Hitachi Chemical Co., Ltd.
Kazuhisa TsunoiDirector, Mobile Phones Unit, Ⅲ,Mobile Phones Div, Advanced Devices Dept.,Fujitsu Ltd.
(honorifics omitted / in random order / as of Sep. 12th, 2011)
PWB EXPOShow ManagementReed Exhibitions Japan Ltd.18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, JapanTEL : +81-3-3349-8518FAX : +81-3-3349-8530E-mail : inw@reedexpo.co.jp