【PWB-10】Universal Prevalence of Built-in Technology ―Industry Trends and Simulation & Component Technology―

Recent Trend of Embedded Technology for Downsizing and Multifunction of Electronic Devices

［Speaker］　
Ichiro Koiwa
Professor,
Dept. of Applied Material and Life Science, Faculty of Engineering,
Kanto Gakuin University

[Abstract]
Downsized and multifunctional electronic devices are necessary for ubiquitous networking society and the embedded technologies make it realize. This presentation reports recent trend and standardization.

Structural Simulation Indispensable to Device Embedded Substrate Manufacturing－Introduction of Availability of Thermal Deformation Analysis－

［Speaker］
Katsumi Miyama
Associate Professor,
Dept. of Mechanical Engineering,
Hokkaido Institute of Technology

[Abstract]
Joining reliability of embedded bare die and substrate is evaluated between some difference layer structure and conductive pattern. Thermal deformation behavior is simulated by thermal deformation analysis and compared with actual deformation.

Component Technology Specific to Embedded Substrate and Approach to Standardization

［Speaker］　
Masashi Aoki
Profit Manager,
Product Management Center,
KOA Corp.

[Abstract]
Development of low profile embedded components suitable for laser via connection or electrically-conductive adhesive is going on now. Standardization = infrastructure construction (e.g. material, component, substrate, machine and quality assurance role) is important for prevailing the brand new technology.

(Honorifics omitted)

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*The speech titles and abstracts are composed by speakers.

For more information, please contact: inw-con@reedexpo.co.jp.