• Exhibit Profile

    PWBs/PCBs

    • Rigid PCBs
    • Multi-layered PCBs
    • Flexible PCBs
    • Multi-layered Flexible PCBs
    • Flexible Rigid PCBs
    • Built-up PCBs
    • Semiconductor Packaging PCBs
    • TOB/COF PCBs
    • Optical PCBs
    • EPD (Embedded Passive Devices)
    • Other PCBs

     

    PCB Materials

    • Rigid Copper-clad laminate
    • Flexible Copper-clad laminate
    • Shield Board
    • Multi PCB Prepreg
    • Copper Foil
    • Insulating Material
  • Design/Development Tools Zone

    Gathering Design/Development Tools from Functional Design Tools to Simulation Tools and CAD/CAM!

    • Functional Design/Logic Design Tool
    • Pattern/Layout Design Tool
    • CAD/CAM/CIM
    • Transmission Line Simulator
    • SI/PI/EMC Analysis
    • Heat Analysis
    • Design Data Control Tool
  • ODM/Design Services Zone

    Gathering Various ODM, Design Services and Contract Development Services

    • Contract Design Services
    • Contract Development Services
    • Prototype Development Services
    • Consulting Services

Contact Us

PWB EXPO
Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
For Exhibiting>>
pcb@reedexpo.co.jp
For Visiting>>
visitor-eng.inw@reedexpo.co.jp

Organised by Reed Exhibitions