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Exhibition Title PWB EXPO–12th Printed Wiring Boards Expo
Held within NEPCON JAPAN × ELECTRONIX R&D JAPAN
  - 40th INTERNEPCON JAPAN
  - 28th ELECTROTEST JAPAN
  - 12th IC PACKAGING TECHNOLOGY EXPO
  - ELE TRADE–12th International Electronic Components Trade Show
  - MATERIAL JAPAN–2nd Advanced Electronic Materials Expo
  - MicroTech JAPAN–1st Micro Fabrication / Fine Process Technology Expo
Concurrent Shows CAR-ELE JAPAN–3rd Int'l Automotive Electronics Technology Expo
EV JAPAN–2nd EV & HEV Drive System Technology Expo
1st Automotive Lightening Technology Expo
LIGHTING JAPAN–3rd LED/OLED Lighting Technology Expo
Dates January 19 (Wed) - 21 (Fri), 2011
Venue Tokyo Big Sight, Tokyo, Japan
Concurrent Events PWB EXPO Technical Conference
Special Fair/ Zone ODM / Design Services Fair
Design / Development Tools Zone
Organised by Reed Exhibitions Japan Ltd.
Services included in
the exhibit price
  • Exhibit Raw Space (excluding display system cost such as the walls, carpet, etc.)
  • Free Invitation Tickets
  • Special VIP Customers Invitation System
  • Free promotion of exhibition by press released to industry's prominent publication / magazines
  • Publishing of your exhibiting information on official website
  • Publishing of your company name & exhibiting information in "Floor Plan" & "Official Web Directory" which are distributed to all visitors

*Other services to increase your exhibiting effect are also available.
Visitor Profile Experts & professionals involved in the wide range of fields related to Electronics Manufacturing
  • Home Appliances
  • Personal Computer Peripheral / Office Equipment
  • Audio / Visual Equipment
  • Test / Inspection Equipment
  • Aircraft / Vessel Equipment
  • Optical Instrument
  • Mobile Communication Systems Equipment
  • Semiconductor Assembly
  • Industrial Control / Factory Automation
  • Transportation Equipment
  • Medical Device and Others  etc.
Exhibit Profile PWBs/PCBs
  • Rigid PCBs
  • Multi-layered PCBs
  • Flexible PCBs
  • Multi-layered Flexible PCBs
  • Flexible Rigid PCBs
  • Built-up PCBs
  • Semiconductor Packaging PCBs
  • TOB/COF PCBs
  • Optical PCBs
  • EPD (Embedded Passive Devices)
  • Other PCBs
PCB Materials
  • Rigid Copper-clad laminate
  • Flexible Copper-clad laminate
  • Shield Board
  • Multi PCB Prepreg
  • Copper Foil
  • Insulating Material
ODM / Design Services Fair
Gathering Various ODM, Design Services and Contract Development Services
  • Contract Design Services
  • Contract Development Services
  • Prototype Development Services
  • Consulting Services
Design / Development Tools Zone
Gathering Design/Development Tools from Functional Design Tools to Simulation Tools and CAD/CAM!
  • Functional Design/Logic Design Tool
  • Pattern/Layout Design Tool
  • CAD/CAM/CIM
  • Transmission Line Simulator
  • SI/PI/EMC Analysis
  • Heat Analysis
  • Design Data Control Tool
Contact Us PWB EXPO Show Management
Attn: Hajime Suzuki (Mr.), Taikoku Kin (Mr.), Kanako Otsuka (Ms.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502  FAX: +81-3-3349-4900
E-mail: pcb@reedexpo.co.jp
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