Previous (2012) Technical Conference Program

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• PWB-K Block

  

  PWB-K Keynote Session

  Jan. 19 [Thur] 13:30-15:00 Top Manufacturers Reveal their Strategies and Future Visions

  Session Leader： Hirofumi Matsumoto, Nippon Mektron, Ltd. Assistant Leader： Koji Ikawa, CMK Corp.
  BMW i–products and Services for Urban Mobility	Evolution of Mobile Data Devices
  Bernhard Blaettel Director, Project Mobility Services, BMW AG	Shigeyoshi Shimotsuji General Manager, Cloud & Solutions Div., Toshiba Corp.

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  ＜Other Sessions＞

  All Sessions Available in English / Japanese

• PWB-1 High-thermal Conductivity Resin Substrates with Growing Attention from Automotive and Smartphone Applications Jan. 18 [Wed] 9:30-12:00	PWB-6 Latest FPC Market and Technology Trends Jan. 18 [Wed] 9:30-12:00
  General Manager, Design Dept.4, Electronics Eng. Div.3, Denso Corp. Arihiro Kamiya Professor, Department of Advanced Materials Chemistry, Yokohama National University Akio Takahashi General Manager, Engineering Group, Printed Circuit Board Business Unit, Panasonic Electronic Devices Co., Ltd. Masaaki Katsumata	Managing Director, Equity Research Dept., Chemical Sector Equity Research, Japan, Barclays Capital Japan Ltd. Mikiya Yamada Semi Consult Hirotaka Ueda Assistant Manager, Marketing Research Team, Marketing Research & Product Development Center, Electronic Materials & System Equipment Group, Tatsuta Electric Wire & Cable Co., Ltd. Masanori Miyamoto

• PWB-2 Latest Technology Trends in LED Heat Radiation Design and Materials Jan. 18 [Wed] 13:30-16:00

  PWB-7 Ultrafine Processing Technology at the Forefront Jan. 18 [Wed] 13:30-16:00

  Engineer, Application Engineering, OSRAM Ltd., Opto Semiconductors Keisuke Maekawa Senior Research Scientist, Leader, Advanced Polymer Materials Lab., Environmental Technology Research Div., Osaka Municipal Technical Research Institute Yasuyuki Agari Shimode Lighting Consultant Sumio Shimode

  Assistant Manager, Tool Engineering Dept., PCB Tool Development Section, Technical Center, Union Tool Co. Toshiyuki Watanabe R&D Manager MC, Photosensitive Materials R&D Dept., Printed Wiring Board Materials Business Sector, Hitachi Chemical Co., Ltd. Tatsuya Ichikawa Team Leader, Senior Researcher, Functionalizing process team, Flexible Electronics Research Center, National Institute of Advanced Industrial Science and Technology Kazuhiro Murata

• PWB-3 Front-line Technology of Further Developing Printed Electronics Jan. 19 [Thur] 9:30-12:00

  PWB-8 Technical Solutions to Achieve Thinner Mobile Devices Jan. 19 [Thur] 9:30-12:00

  Associate Professor, Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo Tsuyoshi Sekitani Associate professor, Laboratory of Cellulose Nanofiber Materials, The Institute of Scientific and Industrial Research, Osaka University Masaya Nogi Div. Director, Electronics and Optoelectronics Research Labs., Flexible Electronics Technology Div., ITRI Jupiter Hu

  Director, Advanced Devices Dept.Ⅲ, Mobile Phone Div., Mobile Phone Unit, Fujitsu Ltd. Kazuhisa Tsunoi Dept. Manager, Engineering Dept., Toyama Plant, NEC Toppan Circuit Solutions, Inc. Toshihide Ito Manager, Product Development Dept.Ⅱ, LSI Packaging Div., IP & Technology Development and Manufacturing Unit, Fujitsu Semiconductor Ltd. Yoshiyuki Yoneda

• PWB-4 Advanced PCB Materials Pioneer the Future — Cutting-edge Technology Development — Jan. 20 [Fri] 9:30-12:00

  PWB-9 Next-generation PCB and Interposer —Possibility of LSI Global Interconnects— Jan. 20 [Fri] 9:30-12:00

  Manager, Electronics Materials Dept., Planning & Development Div., Information & Advanced Materials Company, Mitsubishi Gas Chemical Company, Inc. Masao Someya Staff Engineer, Product Development Group, Circuit Board Materials Div., Electronic Materials Business Unit, Industrial Devices Company, Panasonic Corp. Hiroki Tamiya Manager/Chief Engineer, Telecommunication Materials Development Center, Tsukuba Research Lab., Hitachi Chemical Co., Ltd. Hikari Murai

  Director, General Manager, Advanced Packaging Development Groupe, Kyocera SLC Technologies Corp. Masahiro Fukui President, Worldwide Electric Integrated Substrate Technology Inc. Yoshitaka Fukuoka Senior Research Scientist, Electron Devices Lab., Corporate Research & Development Center, Toshiba Corp. Hiroshi Yamada

• PWB-5 New Technology and Materials for Buildup PCB for Smartphones and Tablets Jan. 20 [Fri] 13:30-16:00	PWB-10 Universal Prevalence of Built-in Technology —Industry Trends and Simulation & Component Technology— Jan. 20 [Fri] 13:30-16:00
  Etching Technology Section, Electronics Technology Development Div. 1, Research & Development Headquarters, Ebara-Udylite Co., Ltd. Hirohisa Ando Global Product Manager, Panel/Pattern Plating, Atotech Deutschland GmbH Stephen Kenny Leader, Development Sec.Ⅰ, Development Dept.Ⅱ, Technical Development Div., Taiyo Ink Mfg. Co., Ltd. Nobuhito Itoh	Professor, Dept. of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University Ichiro Koiwa Associate Professor, Dept. of Mechanical Engineering, Hokkaido Institute of Technology Katsumi Miyama Profit Manager, Product Management Center, KOA Corp. Masashi Aoki

• All Sessions

  All Sessions Available in English / Japanese
  (*Keynote Sessions: English, Chinese, Korean & Japanese.)

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  ＜Concurrent Shows: Keynote Sessions＞

• INJ-K Block(For Other Exhibit)

  

  INJ-K Keynote Session

  Jan. 18 [Wed] 13:30-15:00 Industry Leaders' View: Strength of "Japan's Manufacturing Technologies"

  Perspective Direction for Electronic System View from Super High Band Communication	Fujitsu's Technology that Developed the "K Computer"
  Kanji Otsuka Emeritus Professor, Advisor, Collaborative Research Center of Meisei University	Hideyuki Saso Corporate Senior Executive Vice President, Fujitsu Ltd.

• ICP-K Block (For other Exhibit)

  

  ICP-K Keynote Session

  Jan. 19 [Thur] 10:00-11:30 Future Outlook of Semiconductor Business -Keys to Enhance Electronics Industry-

  Session Leader： Toshihiko Sato, Renesas Kyushu Semiconductor Corp. Assistant Leader： Jun-ichi Kasai, SKLink Co., Ltd.
  Evolution of Semiconductor: For Future Society and New User Experience	Amkor Strategy for Packaging Technology
  Tsuyoshi Abe Director and Vice President, and General Manager of Technology & Manufacturing Group, Intel K.K.	Choon-Heung Lee Corporate Vice President, Head of Corp. Technology HQ, Amkor Technology Korea, Inc.

  
  

• CAR-K Block (For other Exhibit)

  

  CAR-K Keynote Session

  Jan. 18 [Wed] 10:30-12:30 Leading Manufacturers Discuss Future Automotive Electronics for Next-generation Vehicles

  Rapidly Changing Automotive Industry and its Expectations for Car Electronics	Volkswagen Group Strategy for Electric Mobility	Ford's Sustainable Electrification Approach
  Moritaka Yoshida Managing Officer, Toyota Motor Corp.	Rudolf Krebs Executive Vice President, Head of Group E-Traction, Volkswagen AG	Nancy Gioia Director, Global Electrification, Ford Motor Company

• Light-K Block (For other Exhibit)

  

  Light-K Keynote Session

  Jan. 18 [Wed] 13:30-15:30 Corporate Strategies of Global Lighting Manufacturers

  Session Leader： Yoshiteru Sato, New Energy and Industrial Technology Development Organization
  Simply Enhancing Life with Light	Creating Tomorrow: Mastering the Transition to SSL Lighting	Paradigm Shift of General Lighting by LED and New Product Strategy of Toshiba
  Marc de Jong CEO, Business Group Professional Lighting Solutions, Executive Vice President, Philips Lighting	Carsten Setzer Senior Vice President, General Lighting Development, OSRAM AG	Koji Sato Vice President & General Manager, LED Business Group, Toshiba Lighting & Technology Corp.

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  ＜Concurrent Shows: Special Sessions＞

• ICP-S1 Block (For other Exhibit)

  

  ICP-S1 Special Session 1

  Jan. 19 [Thur] 16:15-17:00 Lecture by Leading Authority in Automotive Semiconductor Packaging Field

  Automotive Electronics ―Packaging as Enabler Technology

  Andreas Knoblauch Director Package Development Automotive, Infineon Technologies AG

• ICP-S2 Block (For other Exhibit)

  

  ICP-S2 Special Session 2

  Jan. 20 [Fri] 9:30-10:15 Current Industry Trend in China

  Development of Chinese Electronic Industry and Semiconductor Package

  Noriyoshi Kuromasa Shanghai Bureau Chief, Sangyo Times, Inc.

• ICP-S3 Block (For other Exhibit)

  

  ICP-S3 Special Session 3

  Jan. 20 [Fri] 12:30-13:15 Lecture by Taiwan's No.1 LED Manufacturer

  LED Packaging Technology Impact on Lighting Applications

  Ilkan Cokgor Vice President, Global Marketing, Everlight Electronics Co., Ltd.

• (Honorifics omitted)

  * Please note that the speakers and programs are subject to change.
  * The photographic and video recording rights are reserved to the Show Management.
  *Textbooks of some sessions are not available.
  

  For more information, please contact: inw-con@reedexpo.co.jp

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  Asia's Largest Scale! Learn the cutting-edge in 185 sessions.

  Choose and Click the ones of your interest for details.

  

  Latest technologies and industry trends will be addressed; from Lead-free Soldering, Micro Joint, Cutting-edge Testing Technologies, to Applications to the hottest fields such as Smartphones, Power Modules, etc.

  

  3 Dimensional Assembly, TSV, Copper Wire, In-vehicle Semiconductors, Power Devices, etc., the latest technology trends of IC Packaging.

  

  Device Embedded Substrates, Printed Electronics, Heat-resistant Technologies, FPC etc., the latest technologies and industry trends of PCBs.
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  EV/HEV, Motors, Secondary Batteries, Safety Technologies, the Key to Grab the Emerging Markets, etc., hottest topics in the industry.

  

  Industry trends, Strategies of leading companies, Element technologies, etc., various approaches to LED & OLED Lighting.