【PWB-1】High-thermal Conductivity Resin Substrates with Growing Attention from Automotive and Smartphone Applications

Trend of PCB for Automotive Electronics and Thermal Measure Design

［Speaker］　
Arihiro Kamiya
General Manager,
Design Dept.4, Electronics Eng. Div.3,
Denso Corp.

[Abstract]
We emphasize the importance of the thermal measure design in automotive electronics. Therefore, in the thermal measure design, it is important to consider improvement of the high performance thermal conductive PCB. We refer to the requirement to the PCB.

High Heat Resistant Polymers for Automotive Electronics Technology

［Speaker］　
Akio Takahashi
Professor,
Department of Advanced Materials Chemistry,
Yokohama National University

[Abstract]
Power semiconductor devices are key devices for carbon dioxide reduction technology. Here, we focus on the power semiconductor device module of the automotive electronics field that is holding more than 50% of the power device market and introduce the optimum properties and the examples for polymer materials applying to the future power module.

Latest Technology of "High-thermal Conductivity Resin PCB" and its Future Potential

［Speaker］　
Masaaki Katsumata
General Manager,
Engineering Group, Printed Circuit Board Business Unit,
Panasonic Electronic Devices Co., Ltd.

[Abstract]
Thermal measure design of automotive electronics and smart phone becomes more important in these days. In this presentation, we will explain the latest technology of "High-thermal conductivity resin PCB" and it's future potential.

(Honorifics omitted)

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For more information, please contact: inw-con@reedexpo.co.jp.